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Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rapidly growing interest, owing to their potential uses across a broad range of fundamental and applied areas of application. Recently developed approaches to 3D assembly that rely on controlled buckling mechanics serve as versatile routes to 3D mesostructures in a diverse range of high-quality materials and length scales of relevance for 3D microsystems with unusual function and/or enhanced performance. Nonlinear buckling and delamination behaviors in materials that combine both weak and strong interfaces are foundational to the assembly process, but they can be difficult to control, especially for complex geometries. This paper presents theoretical and experimental studies of the fundamental aspects of adhesion and delamination in this context. By quantifying the effects of various essential parameters on these processes, we establish general design diagrams for different material systems, taking into account 4 dominant delamination states (wrinkling, partial delamination of the weak interface, full delamination of the weak interface, and partial delamination of the strong interface). These diagrams provide guidelines for the selection of engineering parameters that avoid interface-related failure, as demonstrated by a series of examples in 3D helical mesostructures and mesostructures that are reconfigurable based on the control of loading-path trajectories. Three-dimensional micromechanical resonators with frequencies that can be selected between 2 distinct values serve as demonstrative examples. 

3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide‐ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin‐film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio‐interfaces and multifunctional microsystems.

 

3D structures that incorporate high‐performance electronic materials and allow for remote, on‐demand 3D shape reconfiguration are of interest for applications that range from ingestible medical devices and microrobotics to tunable optoelectronics. Here, materials and design approaches are introduced for assembly of such systems via controlled mechanical buckling of 2D precursors built on shape‐memory polymer (SMP) substrates. The temporary shape fixing and recovery of SMPs, governed by thermomechanical loading, provide deterministic control over the assembly and reconfiguration processes, including a range of mechanical manipulations facilitated by the elastic and highly stretchable properties of the materials. Experimental demonstrations include 3D mesostructures of various geometries and length scales, as well as 3D aquatic platforms that can change trajectories and release small objects on demand. The results create many opportunities for advanced, programmable 3D microsystem technologies.

 

Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on two‐dimensional (2D) serpentine configurations, 2D fractal‐inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain‐free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable light‐emitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.